| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for heat-treating a substrate.SOLUTION: An apparatus comprises a substrate support 104 configured to linearly move and/or rotationally move by magnetic-drive. The substrate support is configured to store a radiant heat source 106 for providing a heating region on a part of a chamber. An active cooling region comprising a cooling plate is opposed to the heating region. A substrate 140 is moved between the two regions, so that the substrate can be rapidly heated and cooled in a controlled manner. |
