| 摘要 |
An electronic device 100 includes a casing 101 configured to accommodate electronic components. The casing 101 includes an outer layer member 131 formed by a metal and exposed to an outside, and an inner layer member 132 formed by a metal and spaced from an inner surface of the outer layer member 131. Conductive projections 140a and 140b are each formed between the inner layer member 132 and the outer layer member 131, and are each configured to extend like a line on a surface of one of the inner layer member 132 and the outer layer member 131 and have a top end that contacts with the other of the inner layer member 132 and the outer layer member 131, to electrically connect between the inner layer member 132 and the outer layer member 131. |
