发明名称 NEW COMPOUND, COMPOSITION FOR CURED FILM FORMATION AND CURED FILM
摘要 PROBLEM TO BE SOLVED: To provide a composition for cured film formation, being stable under room temperature conditions, and allowing generation of a base by heating at 150°C to 200°C and formation of a cured film excellent in surface hardness and solvent resistance.SOLUTION: A compound is represented by the formula (1). (In the formula (1), Rand Reach independently represents an alkyl group having a carbon number of 1 to 12, an alkoxyl group having a carbon number of 1 to 12, a halogen, a cyano group or a nitro group. n represents an integer of 0-4, m represents an integer of 0-5, and Xrepresents an onium ion.)
申请公布号 JP2014055114(A) 申请公布日期 2014.03.27
申请号 JP20120199446 申请日期 2012.09.11
申请人 JSR CORP 发明人 ARIMURA YUICHIRO;ENDO TAKESHI
分类号 C07C233/65;C07D213/73;C07D233/06;C07D487/04;C08G59/40;G03F7/004;H01L21/027 主分类号 C07C233/65
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