发明名称 INTRA-SUBSTRATE BUILT-IN CHIP RESISTOR AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an intra-substrate built-in chip resistor having a wide and flat electrode face on its surface and using a conventional structure for an internal electrode on substrate surface, capable of obtaining a wide resistance characteristic, and also having improved ease of mounting.SOLUTION: The intra-substrate built-in chip resistor comprises: a pair of internal electrodes formed on the surface of an insulating substrate; a resistive film formed between the pair of internal electrodes; a first protective film covering a region in which the resistive film is formed and formed so that at least part of the internal electrodes is exposed; a second protective film covering at least part of a region in which the resistive film is formed; a pair of second internal electrodes connected to the exposed section of the internal electrodes and formed so as to cover an end of the second protective film; and an external electrode for covering the second internal electrodes. The external electrode has a wide and flat electrode face. An interval between the pair of second internal electrodes is narrower than that between the pair of internal electrodes, and the surface of the external electrode is higher than the surface of the second protective film.
申请公布号 JP2014057096(A) 申请公布日期 2014.03.27
申请号 JP20130241416 申请日期 2013.11.22
申请人 KOA CORP 发明人 ARIGA KATSUMI;KARASAWA HIDEKAZU
分类号 H01C1/14;H01C1/032;H01C7/00 主分类号 H01C1/14
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