发明名称 PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of adjusting a gap and also capable of achieving both the uniformity of exhaust and the uniformity of plasma processing without lowering efficiency in plasma processing.SOLUTION: The plasma processing apparatus comprises a processing container, a placement stand, an upper electrode, a telescopic cylindrical bulk head, a high frequency power supply, a power feeding member, a drive frame, a drive mechanism, an exhaust device, and a baffle plate. The bulk head connects the placement stand and the bottom wall of the processing container. The power feeding member is connected to the placement stand disposed in a space surrounded by the bulk head. The drive frame extends from outside the side wall of the processing container into a space surrounded by the bulk head and is connected to a lower part of the placement stand. The drive mechanism is placed on the outside of the processing container and used to move the drive frame in the vertical direction. In the lower section of an exhaust space is delimited a cylindrical exhaust path by the bottom and side walls of the processing container and the bulk head. The exhaust device communicates with the exhaust path via an exhaust port in the bottom wall of the processing container.
申请公布号 JP2014056987(A) 申请公布日期 2014.03.27
申请号 JP20120201824 申请日期 2012.09.13
申请人 TOKYO ELECTRON LTD 发明人 YOSHIMURA AKIHIRO;MASUDA YASUSHI;SASAKI NOBUMINE
分类号 H01L21/3065 主分类号 H01L21/3065
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