FILM PEELING APPARATUS

摘要

A film peeling apparatus is provided. The film peeling apparatus according to an embodiment of the present invention is a film peeling apparatus for peeling a film from a substrate in which the film is adhered on a surface. The film peeling apparatus comprises: a transfer module for transferring the substrate which is disposed in a perpendicular direction to the bottom surface; and a peeling module for peeling the film from the substrate transferred by the transfer module.