发明名称 Procedimiento para tender paneles de suelo
摘要 A method for laying floor panels in a room to form a closed floor area on a laying plane (R) without using an adhesive. The floor panels especially comprising a wood material, such as MDF or HDF, and having matching corresponding profiles on opposite longitudinal edges (I, I′) and transverse edges (II, II′). The closed floor area is obtained by interconnecting a plurality of panels on their transverse edges (II, II′) to give a row (R1) and on their longitudinal edges (I,I′) to give a plurality of rows (Rn) and then locking them in relation to each other.
申请公布号 ES2445205(T8) 申请公布日期 2014.03.26
申请号 ES20090776822T 申请日期 2009.06.24
申请人 FLOORING TECHNOLOGIES LTD. 发明人
分类号 E04F15/02 主分类号 E04F15/02
代理机构 代理人
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