发明名称 Platen ground pin for connecting substrate to ground
摘要 Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a ground pin that extends two regions of a platen that support the substrate. The ground pin may comprise a pin body; and a sleeve comprising an upper portion, a side portion, and a lower portion, the sleeve being configured to fit around the pin body, the sleeve including a fluid channel configured to transport fluid between the upper portion and the lower portion of the sleeve.
申请公布号 US8681472(B2) 申请公布日期 2014.03.25
申请号 US20090487444 申请日期 2009.06.18
申请人 SUURONEN DAVID E.;STONE DALE K.;OSHIRO SHIGEO;RIAF ARTHUR P.;MACINTOSH EDWARD D.;VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. 发明人 SUURONEN DAVID E.;STONE DALE K.;OSHIRO SHIGEO;RIAF ARTHUR P.;MACINTOSH EDWARD D.
分类号 H01L21/683 主分类号 H01L21/683
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