发明名称 Cooling structure, image forming apparatus having cooling structure, and electronic apparatus having cooling structure
摘要 A disclosed cooling structure includes a casing including a bottom plate arranged in a bottom portion of the casing and having a through hole formed in the bottom plate; a heat source to be cooled accommodated in the casing; a suctioning unit configured to suction outer air from an outside of the casing to an inside of the casing via the through hole in the bottom plate; an open and close member including an outer air path for carrying the suctioned outer air and being capable of opening and closing relative to the casing; and an outer air applying unit configured to cool the heat source by the carried outer air received from the open and close member.
申请公布号 US8682203(B2) 申请公布日期 2014.03.25
申请号 US201113253133 申请日期 2011.10.05
申请人 KIKUSHIMA YUUKI;TAKAYAMA MAMORU;SUZUKI HIROSHI;AIZAWA SATOSHI;RICOH COMPANY, LTD. 发明人 KIKUSHIMA YUUKI;TAKAYAMA MAMORU;SUZUKI HIROSHI;AIZAWA SATOSHI
分类号 G03G21/20 主分类号 G03G21/20
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