EMBEDDED COMPONENT SUBSTRATE AND METHOD FOR MANUFACTURING SAME

摘要

An embedded component substrate (15) equipped with: a conductor pattern (6) formed on a substrate surface; an adhesive layer (10) formed on the inside of the conductor pattern (6); electric or electronic components (3) adhered to the adhesive layer (10); electrodes (3b) covering the component main body (3a) forming each component (3) and covering the left and right ends of the component main body (3a); an insulation layer (2) comprising an insulation material and in which a component group (14) formed of multiple components (3) is buried; and conductive vias (7) that electrically connect the conductor pattern (6) and the electrodes (3b), and are formed by performing a plating process with respect to vias (13) formed by penetrating the adhesive layer (10) by means of a laser. The electrodes (3b) have a step (16) that protrudes from the component main body (3a) toward the adhesive layer (10), and the lengths of all of the steps (16) of the components (3) forming the component group (14) are between 10-20μm.