发明名称 ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting device in which occurrence of suction abnormality can be avoided as much as possible.SOLUTION: When a suction nozzle 2 suction holding an electronic component ascends an ascend first stage stroke s1 and reaches a one end stop height Sc, the suction nozzle 2 is retained for an ascend 1 retention time t1. When the suction nozzle 2 ascends, an electronic component 40 comes into contact with the upper edge or the sidewall of a component housing section 42 and is hooked thereto, and even if the electronic component 40 is skewed, it is sucked by the suction nozzle 2 during the ascend 1 retention time T1, and can be returned back to a normal suction position.
申请公布号 JP2014053503(A) 申请公布日期 2014.03.20
申请号 JP20120197910 申请日期 2012.09.07
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 KAMEDA MAKIO;OYAMA KAZUYOSHI;HAMAZAKI KAZUKI
分类号 H05K13/04 主分类号 H05K13/04
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