| 摘要 |
A method for treating a Cu thin sheet is provided. The method comprises the steps of: supplying a slurry in which a diffusion bonding aid (DBA), such as Ni powder, and a reinforcing material (RM), such as a carbide base metal compound, are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer. In the method, the weight ratio of DBA to RM is specified to be 80:20 to 50:50, and the median diameters D50 of both DBA and RM employed fall within 0.1 to 100μm, the median diameter D50 of DBA is larger than the median diameter D50 of RM, and both the distribution ratio D90/D10 of DBA and the distribution ratio D90/D10 of RM are 4.0 or less. |
