MEMS SWITCHES AND OTHER MINIATURIZED DEVICES HAVING ENCAPSULATING ENCLOSURES, AND PROCESSES FOR FABRICATING SAME

摘要

Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).