| 摘要 |
Provided is a Peltier module for a laser diode that can be mounted with a high-melting-point solder. This Peltier module (10) for a laser diode is equipped with: a heat-emission-side substrate (1a), heat-emission-side electrodes (2a), p-type thermoelectric conversion elements (3a), n-type thermoelectric conversion elements (3b), a joint solder layer (4), and a Ni-containing layer (5). The joint solder layer (4) is arranged between the heat-emission-side electrodes (2a) and the p-type thermoelectric conversion elements (3a) and n-type thermoelectric conversion elements (3b), and has an Ni intermetallic compound (41) containing Au and Sn, an Au5Sn intermetallic compound (42), and a eutectic composition (43) containing an Au5Sn intermetallic compound and an AuSn intermetallic compound. The Ni-containing layer (5) is arranged between the joint solder layer (4) and the heat-emission-side electrodes (2a), and between the joint solder layer (4) and the p-type thermoelectric conversion elements (3a) and n-type thermoelectric conversion elements (3b). The eutectic ratio of the joint solder layer (4) is 15.1% or less. |
