| 摘要 |
FIELD: physics.SUBSTANCE: method of making a light-emitting diode (LED) module according to the invention involves forming an insulating film on a substrate; forming, on the insulating film, a first earthing terminal pad and a second earthing terminal pad separate from each other; forming a first separating film which fills the space between the first and second earthing terminal pads, a second separating film which is deposited on the surface of the first earthing terminal pad and a third separating film which is deposited on the surface of the second earthing terminal pad; forming a first separating layer of given height on each of the separating films; sputtering seed metal on the substrate on which the first separating layer is formed; forming a second separating layer of given height on the first separating layer; forming a first mirror which is connected to the first earthing terminal pad, and a second mirror which is connected to the second earthing terminal pad by applying a metal coating on the substrate on which the second separating layer is formed; removing the first and second separating layers; connecting a stabilitron to the first mirror and connecting a LED to the second mirror; and depositing a fluorescent substance to fill the space formed by the first mirror and the second mirror. The invention also discloses another version of the method described above and the design of the LED module.EFFECT: improving relative luminosity of the LED element by improving heat-dissipation capacity when making a LED module with high brightness, and obtaining a small LED module with high brightness at a low cost, considerably low failure rate of the module and manufacturing cost per unit, using a semiconductor process which facilitates mass production.19 cl, 13 dwg |
