发明名称 PEELING SYSTEM
摘要 PROBLEM TO BE SOLVED: To enhance the throughput.SOLUTION: A peeling system includes a first processing block, and a second processing block. The first processing block includes a first transport device, a peeling station, a first cleaning station, a pasting station, and a carry-out station. In the peeling station, a peeling device for peeling a superposed substrate, transported by a first transport device, into a first substrate and a second substrate by sliding the superposed substrate, while heating, along the joint surface of the first substrate and second substrate is installed. The second processing block includes a second cleaning station, a first delivery station, a carry-in/carry-out station, a second transport device, and a second delivery station.
申请公布号 JP2014053465(A) 申请公布日期 2014.03.20
申请号 JP20120197214 申请日期 2012.09.07
申请人 TOKYO ELECTRON LTD 发明人 HIRAKAWA OSAMU
分类号 H01L21/677;H01L21/02;H01L21/304;H01L21/683 主分类号 H01L21/677
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