发明名称 |
Ladder Bump Structures and Methods of Making Same |
摘要 |
An embodiment ladder bump structure includes an under bump metallurgy (UBM) feature supported by a substrate, a copper pillar mounted on the UBM feature, the copper pillar having a tapering curved profile, which has a larger bottom critical dimension (CD) than a top critical dimension (CD) in an embodiment, a metal cap mounted on the copper pillar, and a solder feature mounted on the metal cap. |
申请公布号 |
US2014077359(A1) |
申请公布日期 |
2014.03.20 |
申请号 |
US201313734811 |
申请日期 |
2013.01.04 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
TSAI PEI-CHUN;TSENG YU-JEN;KUO TIN-HAO;CHEN CHEN-SHIEN |
分类号 |
H01L23/498;H01L21/48 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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