发明名称 METHOD FOR NON-PLANAR CHIP ASSEMBLY
摘要 Methods and apparatuses for assembly of a non-planar device based on curved chips are described. Slots may be created as longitudinal openings in the chips to reduce bending stresses to increase allowable degrees of deformation of the chips. The chips may be deformed to a desired deformation within the allowable degrees of deformation via the slots. Holding constraints may be provided on at least a portion of the chips to allow the chips to remain curved according the desired deformation.
申请公布号 US2014080257(A1) 申请公布日期 2014.03.20
申请号 US201314084482 申请日期 2013.11.19
申请人 FAN LONG-SHENG 发明人 FAN LONG-SHENG
分类号 H01L23/00 主分类号 H01L23/00
代理机构 代理人
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