DOUBLE PLATE USING IN SUBSTRATE PRESSING AND METHOD FOR PRESSING SUBSTRATE
摘要
The present invention relates to a double plate for pressing substrates and a method for pressing substrates. According to one embodiment of the present invention, provided is a double plate which is interposed between substrates when multiple substrates are pressed and comprises: a first plate: a second plate having different coefficient of thermal expansion from the first plate; and a bonding layer arranged between the first and the second plates, bonding the plates and curtailing mutual influence due to the thermal expansion of each plate. Also, a method for pressing substrates using the double plate is provided.
申请公布号
KR101376950(B1)
申请公布日期
2014.03.20
申请号
KR20120157174
申请日期
2012.12.28
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, GYOU NAM;PARK, JONG TAE;KANG, HO SHIK;EUN, SANG IL;SEO, DEA SEOK