发明名称 DOUBLE PLATE USING IN SUBSTRATE PRESSING AND METHOD FOR PRESSING SUBSTRATE
摘要 The present invention relates to a double plate for pressing substrates and a method for pressing substrates. According to one embodiment of the present invention, provided is a double plate which is interposed between substrates when multiple substrates are pressed and comprises: a first plate: a second plate having different coefficient of thermal expansion from the first plate; and a bonding layer arranged between the first and the second plates, bonding the plates and curtailing mutual influence due to the thermal expansion of each plate. Also, a method for pressing substrates using the double plate is provided.
申请公布号 KR101376950(B1) 申请公布日期 2014.03.20
申请号 KR20120157174 申请日期 2012.12.28
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, GYOU NAM;PARK, JONG TAE;KANG, HO SHIK;EUN, SANG IL;SEO, DEA SEOK
分类号 H05K3/46 主分类号 H05K3/46
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