| 摘要 |
The present invention relates to a plasma processing apparatus, capable of efficiently dealing with an object with a curved shape by a plasma discharge port which downwardly and laterally protrudes. The plasma processing apparatus for processing a curved surface according to the present invention includes: a planar dielectric base electrode on which a plurality of through holes are formed; a ground electrode group which is arranged on the lower side of the dielectric base electrode and is composed of a plurality of ground electrodes; a reactive gas supply unit which supplies reactive gas from the upper side to the lower side of the dielectric base electrode; and the plasma discharge port which is installed on the lower side of the ground electrode group to downwardly protrude and discharges the generated plasma to the lower side thereof and the lower lateral side thereof. |
