| 摘要 |
The interposer of a first semiconductor package includes a power line for a second semiconductor device. The power line includes a power pattern which provides a land which is provided in a surface layer and an inner layer, and is electrically connected to a land. The power line is provided to a different surface layer and further includes the number of the lands which is greater than that of the land which is electrically connected in parallel to the power pattern. In a stack type semiconductor device, this composition improves the power quality of the second semiconductor device, prevents an increase in inductance which is generated due to the deviation of a connection gap and the bending of the power path of the power line of a print line plate, and can secure a signal processing operation. |
