| 摘要 |
The invention relates to an improved process for hotmelt adhesive bonding based on a thermoplastic polyurethane using a thermoplastic polyurethane (TPU) obtainable from essentially one symmetric aliphatic diisocyanate A and at least one isocyanate-reactive compound B containing hydroxyl and/or amino groups as an adhesive, wherein the number-average molecular weight (Mn) of compound B is at least 2200 g/mol, with the proviso that it is at least 950 g/mol when compound B is a sebacic ester, the diisocyanate A and the at least one isocyanate reactive compound B are reacted in the presence of a catalyst for the polyaddition reaction, the TPU does not contain a chain extender, the TPU has an index K of less than 1000, preferably of less than 990 and more preferably of less than 980, and the hotmelt adhesive bonding is effected by the TPU in the molten state at a temperature of 50°C to 160°C in the absence of solvents, and to substrates bonded thereby. |
