发明名称 Method of forming gate dielectric layer and method of fabricating semiconductor device
摘要 A method for fabricating a semiconductor device includes ion-implanting germanium into a monocrystalline silicon-containing substrate; forming a gate oxide layer over a surface of the monocrystalline silicon-containing substrate and forming, under the gate oxide layer, a germanium-rich region in which the germanium is concentrated, by performing a plasma oxidation process; and crystallizing the germanium-rich region by performing an annealing process.
申请公布号 US8673754(B2) 申请公布日期 2014.03.18
申请号 US201213494288 申请日期 2012.06.12
申请人 LEE SEUNG-MI;JI YUN HYUCK;KIM BEOM-YONG;JEON BONG-SEOK;SK HYNIX INC. 发明人 LEE SEUNG-MI;JI YUN HYUCK;KIM BEOM-YONG;JEON BONG-SEOK
分类号 H01L21/425 主分类号 H01L21/425
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