| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device which can uniformly bond a substrate with a film and a bonded body obtained from the bonding device.SOLUTION: A bonding device 1 is a device for bonding a substrate and a film with application of heat. The bonding device 1 comprises a main body 21, a stage 2 that has a support part 22 for supporting the substrate, heat means that heats the substrate via the support part 22 in a supported state in which the substrate is supported by the support part 22, a pressure roller 4 that rolls while pressing the film onto the substrate in the supported state, and gas supply means 7 that supplies gas G into a space 24 surrounded by the main body 21, the support part 22 and the substrate in the supported state. The gas supply means 7 has four inlets 71 through which the gas G flows into the space 24 and an outlet 72 through which the gas G flows out from the space 24, and each of the inlets 71 is disposed at a position closer to the support part 22 side than the outlet 72 side. |
