| 摘要 |
<p>The present invention relates to a method for manufacturing a semiconductor package and, more specifically, to a method for manufacturing a semiconductor package capable of easily manufacturing the semiconductor package which is manufactured as a structure in which a chip is laminated by using a TCNCP bonding method without defects. The present invention provides the method for manufacturing the semiconductor package capable of temporally attaching a lower surface of a lower chip to a thermosetting releasing film attached to a substrate; conductively laminating an upper chip on the lower chip with a non-conductive paste after temporally attaching the lower chip to the substrate with a non-conductive film attached to the lower surface of the lower chip; conductively attaching the lower chip to the substrate; and preventing the penetration of the non-conductive paste from the lower surface of the lower chip by using the thermosetting releasing film or the non-conductive film when a chip laminated package is manufactured. [Reference numerals] (AA) Curing at 200°C</p> |
