发明名称 MOLDED COMPONENT AND METHOD FOR MANUFACTURING A MOLDED COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a molded component constituted, without requiring special scheme steps or molding facilities for treating a gate residue, to avoid the interference of the gate residue with another component and a method for manufacturing the same molded component.SOLUTION: The molded component provided by the present invention is a molded component 5 constituted by a primary molded artifact 10 molded by means of primary molding and a secondary molded artifact 20 molded by means of secondary molding on the outer surface of the primary molded artifact wherein a pitted portion 13 is configured on the outer surface of the primary molded artifact and wherein the gate residue 17b of the primary molded artifact is housed within the pitted portion.
申请公布号 JP2014046636(A) 申请公布日期 2014.03.17
申请号 JP20120193084 申请日期 2012.09.03
申请人 MITSUBISHI PENCIL CO LTD 发明人 SATO JUNJI;SUMITOMO HAJIME
分类号 B29C45/26;B29C45/16 主分类号 B29C45/26
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