| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which the reliability of connection is improved according to various mounting configurations, and to provide a method of manufacturing the same.SOLUTION: A semiconductor device includes a conductive member 20, a semiconductor element 10, and a sealing portion 40. The semiconductor element 10 is provided on a top surface of the conductive member 20. The sealing portion 40 seals a part of the conductive member 20 and the semiconductor element 10. A top edge of the semiconductor element 10 is located higher than the uppermost portion of the conductive member 20. The conductive member 20 has inclined surfaces 202, 202a, and 202b that are provided outside the sealing portion 40 and in which the angle formed with the top surface is acute, and bottom surfaces that are provided outside the sealing portion 40 and in which the angle formed with the inclined surfaces 202, 202a, and 202b is obtuse. |
