| 摘要 |
PROBLEM TO BE SOLVED: To provide a mechanism for connecting a ground exposure part of an image sensor substrate and a ground member of a device body electrically, without applying a mechanical load to the image sensor mounted on the image sensor substrate.SOLUTION: An image pick-up device includes an image sensor substrate 104 having an image sensor mounting part 104b on which an image sensor 102 is mounted, a connector mounting part 104a on which a connector 202 is mounted, and a connection 201 for connecting the image sensor mounting part 104b and the connector mounting part 104a electrically. The connection 201 is a flexible printed circuit board, both the image sensor mounting part 104b and connector mounting part 104a are hard substrates, and disposed in parallel in a direction orthogonal to the optical axis. On the surface of the connector mounting part 104a on the reverse side of the mounting surface of the connector 202, a ground exposure part 203 is provided, and connected electrically with the ground member 101 of the device body via a conductive elastic member 103. |
