| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for producing an electronic component, and more specifically, to provide a pressure-sensitive adhesive tape for production, in which pressure-sensitive adhesion is expressed only during a thermal lamination step, although a pressure-sensitive adhesive layer is not pressure-sensitive adhesive at room temperature, and consequently with which lamination on a lead frame is enabled, which has improved thermal resistance with regard to thermal history due to exposure of the pressure-sensitive adhesive tape during a production process of a semiconductor apparatus, owing to formation of a partial interpenetration reticular structure caused by additional photo-curing of the pressure-sensitive adhesive layer, which is useful for reliability improvement of a device during production of the semiconductor apparatus, and which can prevent leakage of an encapsulation material and can prevent a transfer of a pressure-sensitive adhesive to the lead frame or to the encapsulation material in removing the tape after completion of the process.SOLUTION: A pressure-sensitive adhesive tape for producing an electronic component includes a thermal-resistant substrate, a pressure-sensitive adhesive layer formed by applying a pressure-sensitive adhesive composition to the thermal-resistant substrate, the pressure-sensitive adhesive composition includes a phenoxy resin, a thermal curing agent, an energy ray-curable acrylic resin, and a photoinitiator, and the pressure-sensitive adhesive layer is cured by heat and an energy ray. |
