发明名称 WIRING BOARD
摘要 <p>This wiring board is provided with: a substrate having a first surface, and a second surface inverse with respect to the first surface; and a transmission line having two parallel through wires formed inside the substrate and exposed at the first surface and the second surface. At least one of the two through wires is provided with a neck portion having a smaller diameter than the diameter of the at least one through wire at the first surface and the diameter of the at least one through wire at the second surface.</p>
申请公布号 WO2014038542(A1) 申请公布日期 2014.03.13
申请号 WO2013JP73665 申请日期 2013.09.03
申请人 FUJIKURA LTD. 发明人 UEMICHI YUSUKE
分类号 H05K1/11;G06F1/18;H04L25/02;H05K3/40 主分类号 H05K1/11
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