| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component in which functional decline of an electronic component element is prevented by dissipating heat generated from a resin molded electronic component element efficiently from the back surface of a package body.SOLUTION: An electronic component 10 includes a package body 16 which includes an electronic component element 13 being mounted on a die pad 12 provided on one terminal side of one lead 11 for external connection, and connects a wire bond pad 14 provided on one terminal side of other leads 11a, 11b for external connection and the electronic component element 13 electrically via a bonding wire, and then resin molds the other terminal side of all leads 11, 11a, 11b for external connection while projecting outward, and a ceramic substrate 18 being bonded to the back surface of the package body 16, including the back surface of the die pad 12 exposed to the outer surface of the back surface, via an adhesive resin 17 containing a ceramic filler composed of at least one kind of AlN, BN or AlO. |
