发明名称 HIGH-FREQUENCY PACKAGE
摘要 In a multilayer substrate, a quasi-coaxial line is formed as a structure for transmitting a high-frequency signal generated by a mounted high-frequency device from an uppermost layer to a lowermost layer to externally output and for transmitting an externally input high-frequency signal from the lowermost layer to the high-frequency device. The quasi-coaxial line has: a central conductor being a vertical through hole via that connects between a metal pattern formed on an upper surface of the uppermost layer and a metal pattern formed on a lower surface of the lowermost layer; and outer conductors being a plurality of interlayer vias that are circularly arranged around the central conductor and connect between two or more layers. Whole or a part of the vertical through hole via is substituted by a capacitor structure formed of conductor pads facing each other without any via.
申请公布号 US2014069706(A1) 申请公布日期 2014.03.13
申请号 US201214119295 申请日期 2012.01.12
申请人 UNNO TOMOYUKI;INAMI KAZUYOSHI;YASOOKA KOSUKE;MITSUBISHI ELECTRIC CORPORATION 发明人 UNNO TOMOYUKI;INAMI KAZUYOSHI;YASOOKA KOSUKE
分类号 H05K1/11 主分类号 H05K1/11
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