发明名称 ETCHING METHOD, ETCHING APPARATUS AND CHEMICAL SOLUTION
摘要 An etching method according to an embodiment, includes performing etching on a material having tungsten (W) as a main component by using as an etchant a chemical solution having hydrogen peroxide as a main component. The chemical solution contains 12 ppm or more and 100,000 ppm or less of W.
申请公布号 US2014073069(A1) 申请公布日期 2014.03.13
申请号 US201313788216 申请日期 2013.03.07
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 TAKAMI NAGISA;UOZUMI YOSHIHIRO
分类号 H01L21/306 主分类号 H01L21/306
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