发明名称 THERMAL STORAGE DEVICE AND STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a thermal storage device that suppresses the height of a heat exchange member performing heat exchange with the outside of the device.SOLUTION: A thermal storage panel 1 comprises: a face plate 11 that performs heat exchange with the outside of a device; a back plate 17 that is provided so as to form a gap with the face plate 11 and forms a closed space from and to the face plate 11; and a phase change material 20 that is encapsulated between the face plate 11 and the back plate 17 and is subjected to phase change between a solid phase and a liquid phase by heat exchanged with the outside of the device. When the encapsulated phase change material 20 is subjected to temperature change beyond a melting point with phase change, the gap between the face plate 11 and the back plate 17 is a distance of being subjected to temperature change beyond the melting point of the phase change material 20 after the phase change of the encapsulated phase material 20 is completed.
申请公布号 JP2014044004(A) 申请公布日期 2014.03.13
申请号 JP20120186682 申请日期 2012.08.27
申请人 HOKKAIDO UNIV 发明人 NAGANO HOSEI;HIRAKO TAKASHI;TOTANI TAKESHI
分类号 F28D20/00;C09K5/06 主分类号 F28D20/00
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