| 发明名称 |
SILVER PASTE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME |
| 摘要 |
This silver paste composition contains silver particles with diameters of 0.1 mum to 20 mum, and a solvent. The solvent comprises a solvent having a boiling point of not less than 300°C. |
| 申请公布号 |
WO2014038331(A1) |
申请公布日期 |
2014.03.13 |
| 申请号 |
WO2013JP71170 |
申请日期 |
2013.08.05 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
ISHIKAWA DAI;MATSUMOTO HIROSHI;NATORI MICHIKO;NAKAKO HIDEO;TANAKA TOSHIAKI |
| 分类号 |
H01B1/22;H01L21/52 |
主分类号 |
H01B1/22 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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