发明名称 |
DEVICES AND METHODS FOR 2.5D INTERPOSERS |
摘要 |
<p>Polyimide-based redistribution layers (RDLs) can be employed to reduce thermo- mechanical stress that is exerted on conductive interconnections bonded to interposers in 2.5 D semiconductor packaging configurations. The polyimide-based RDL is located on an upper or lower face of an interposer. Additionally, height differentials between laterally adjacent semiconductor dies in 2.5 D semiconductor packages can be reduced or eliminated by using different diameter micro-bumps, different height copper pillars, or a multi-tiered interposer to lower taller semiconductor dies in relation to shorter semiconductor dies.</p> |
申请公布号 |
WO2014036976(A1) |
申请公布日期 |
2014.03.13 |
申请号 |
WO2013CN83221 |
申请日期 |
2013.09.10 |
申请人 |
HUAWEI TECHNOLOGIES CO., LTD. |
发明人 |
MOHAMMED, ANWARA;LIU, WEIFENG;NIU, RUI |
分类号 |
H01L23/522;H05K7/00 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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