发明名称 |
SYSTEMS AND METHODS FOR COOLING OF POWER ELECTRONIC DEVICES |
摘要 |
The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components. |
申请公布号 |
EP2705737(A1) |
申请公布日期 |
2014.03.12 |
申请号 |
EP20110864749 |
申请日期 |
2011.09.19 |
申请人 |
CLEAN WAVE TECHNOLOGIES INC. |
发明人 |
GARRIGA, RUDOLPH;KUBIC, MICHAEL |
分类号 |
H05K7/20;H01L23/34;H01L23/367 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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