摘要 |
An array of sensor modules which allows the mass production of sensor modules with an automated method and can improve the mount work convenience. An array of sensor modules according to an embodiment of the present invention includes: sensor modules in which a printed circuit board, a sensor unit, and a connector are integrated; and a plate body for connecting the sensor modules in rows and columns which are set according to the order of the sensor modules. The sensor unit is formed on one side of the printed circuit board, and the connector is formed on the other side and arranged to be parallel and symmetric up and down to the sensor unit with the printed circuit board interposed therebetween. |