发明名称 |
HIGH-FREQUENCY CIRCUIT SUBSTRATE |
摘要 |
The invention offers a high-frequency circuit substrate that sufficiently decreases the transmission delay and transmission loss in comparison with the conventional high-frequency circuit substrate. In the offered high-frequency circuit substrate, a dielectric layer made of fluororesin is brought into intimate contact directly with a metal conductor that is used for wiring and that has a surface not subjected to coarsening treatment or primer treatment. The offered high-frequency circuit substrate causes a transmission loss of -3 dB/m or less at a frequency of 1 GHz and has a combined specific inductive capacity of 2.6 or less and a combined dielectric loss tangent of 0.0007 or less. |
申请公布号 |
KR20140031161(A) |
申请公布日期 |
2014.03.12 |
申请号 |
KR20137008398 |
申请日期 |
2012.05.21 |
申请人 |
SUMITOMO ELECTRIC FINE POLYMER, INC. |
发明人 |
NAKABAYASHI MAKOTO;IKEDA KAZUAKI |
分类号 |
H05K3/38;H05K1/03;H05K1/09 |
主分类号 |
H05K3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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