| 摘要 |
Provided are a semiconductor processing sheet, which has good pick-up performance, suppresses the sequential degradation of the pick-up performance, and obtains expansion efficiency while suppressing the generation of dicing powder, especially thread-shaped dicing powder, generated in an object dicing process; and a method for manufacturing a semiconductor device using the semiconductor processing sheet. The semiconductor processing sheet (1) comprises a base film (2) and an adhesive layer (3) laminated on one side of the base film (2). The base film (2) includes a resin layer (A) located on the side of the adhesive layer (3) and a resin layer (B) laminated on the other side of the adhesive layer (3) of the resin layer (A). The resin layer (A) contains norbornene-based resin (a1) to be a norbornene-based compound as at least one kind of monomer and olefin-based resin (a2) which is resin other than the norbornene-based resin (a1), resin density is 0.870-0.910 g/cm^3, and fusion calory (ΔH) is 85 J/g or less. The resin layer (B) is the olefin-based resin as a main component, in which the tensile modulus is 50-300 MPa, and the break elongation is 100% or greater. |
