发明名称 Resist pattern-forming method
摘要 A resist pattern-forming method includes applying a resist underlayer film-forming composition to a substrate to form a resist underlayer film. The resist underlayer film-forming composition includes (A) a polysiloxane. A radiation-sensitive resin composition is applied to the resist underlayer film to form a resist film. The radiation-sensitive resin composition includes (a1) a polymer that changes in polarity and decreases in solubility in an organic solvent due to an acid. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent.
申请公布号 US8669042(B2) 申请公布日期 2014.03.11
申请号 US201213434851 申请日期 2012.03.30
申请人 ANNO YUSUKE;MORI TAKASHI;SAKAKIBARA HIROKAZU;FURUKAWA TAIICHI;TAKANASHI KAZUNORI;TANAKA HIROMITSU;MINEGISHI SHIN-YA;JSR CORPORATION 发明人 ANNO YUSUKE;MORI TAKASHI;SAKAKIBARA HIROKAZU;FURUKAWA TAIICHI;TAKANASHI KAZUNORI;TANAKA HIROMITSU;MINEGISHI SHIN-YA
分类号 G03F7/26 主分类号 G03F7/26
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