发明名称 |
Methods of fluxless micro-piercing of solder balls, and resulting devices |
摘要 |
A method of establishing conductive connections is disclosed. The method includes providing an integrated circuit die having a plurality of solder balls each of which has an oxide layer on an outer surface of the solder ball. The method also includes performing a heating process to heat at least the solder balls and applying a force causing each of a plurality of piercing bond structures on a substrate to pierce one of the solder balls and its associated oxide layer to thereby establish a conductive connection between the solder ball and the piercing bond structure. |
申请公布号 |
US8669173(B2) |
申请公布日期 |
2014.03.11 |
申请号 |
US201313873509 |
申请日期 |
2013.04.30 |
申请人 |
MICRON TECHNOLOGY, INC.;MICRON TECHNOLOGY |
发明人 |
LEE TECK KHENG |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|