| 摘要 |
An image pickup device includes: an image pickup element; a spacer surrounding a light receiving surface of the image pickup element; a cover glass attached to the spacer, the cover glass being disposed opposing to the light receiving surface; and an insulative resin configured to thermally couple the image pickup element with the cover glass, and to have a thermal conductivity of not less than 8 W/mK. An endoscope includes: the image pickup device; an image pickup optical system; a drive circuit; a light guide configured to radiate light from a illumination light source; a tubular body configured to accommodate the image pickup device, the image pickup optical system, the drive circuit, the light guide, and a forceps opening; and a first insulative resin having a thermal conductivity of not less than 8 W/mK, and adapted to thermally couple the image pickup device with the drive circuit. |
