| 摘要 |
<p>Proivided are a photoresist composition suitable for depositing a thick photoresist layer when applying a single coating and a method. Such photoresist layer, for example, is especially appropriate for chip scale packaging when forming a metal bump. Specifically a photosensitive composition comprises: a binder polymer manufactured by free radical polymerizing acrylic acid and or methacrylic acid with at least one monomer selected among acrylate monomer, methacrylate monomer, and vinyl aromatic monomer; a polymerizable free radical monomer having two or more ethylene-based unsaturated group; a free radical photoinitiator; and a stable free radical inhibitor comprising 2,2,6,6-tetramethyl-1- piperidinyl oxy, 2,2-diphenyl-1-picrylhydrazyl, or derivatives of the sames, and is capable of being coated by at least 50 microns of dried thickness by spin coating while single application.</p> |
