| 摘要 |
The present invention relates to a semiconductor device capable of performing a boundary scan test to check the connection of a channel and, more particularly, to a semiconductor device comprising: a first unit input/output unit including a first input unit for receiving a first test data through a first input channel, and a first output unit for receiving an output signal to the first input unit and outputs the output signal through a first output channel; and a second unit input/output unit including a second input unit for receiving a second test data through a second input channel, and a second output unit for receiving an output signal of the second input unit and outputs the output signal through a second output channel, wherein the output signal of the first input unit is transmitted to the first output unit through a first global test line, and the output signal of the second input unit is transmitted to the second output unit through a second global test line. [Reference numerals] (210) Test device; (220) Semiconductor device; (221_1) First input/output unit; (221_2) Second input/output unit; (222_1) Third input/output unit; (222_2) Fourth input/output unit |
