The present invention relates to a substrate processing method comprising the following steps: processing a substrate with chemical liquid; rinsing the substrate with pure water after the processing with the chemical liquid; and processing the substrate with organic solvent wherein a step of coating the substrate with hydrophobic film is implemented between the chemical liquid processing step and the organic solvent processing step. [Reference numerals] (AA) Start; (BB) End; (S10) Processing a substrate with chemical liquid; (S20) Rinsing the substrate with pure water; (S30) Coating the substrate with hydrophobic film; (S40) Cleaning and drying the substrate with organic solvent; (S50) Removing the hydrophobic film from the substrate
申请公布号
KR20140029095(A)
申请公布日期
2014.03.10
申请号
KR20120156312
申请日期
2012.12.28
申请人
SEMES CO., LTD.
发明人
LEE, KANG SUK;LEE, JAE MYOUNG;LEE, BOK KYU;LEE, YONG HEE;LEE, JIN BOK