发明名称 |
Microelectronic assemblies having very fine pitch stacking |
摘要 |
A method of making a stacked microelectronic assembly includes providing a first microelectronic package that includes a first substrate having a first dielectric layer, conductive posts, and conductive traces extending along the surface of the first dielectric layer; providing a second microelectronic package including a second substrate that includes a second dielectric layer; securing a microelectronic element to one of the surfaces of at least one of the first or second substrates; and joining the conductive posts of the first substrate with the fusible masses of the second substrate. The posts may include a plurality of aligned posts which are aligned in a first row extending in a single orthogonal direction along a surface of the first substrate away from a portion of the first substrate that faces a face of the microelectronic element. The aligned posts are disposed beyond one of the edges of the microelectronic element.
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申请公布号 |
US8067267(B2) |
申请公布日期 |
2011.11.29 |
申请号 |
US20050318164 |
申请日期 |
2005.12.23 |
申请人 |
HABA BELGACEM;MITCHELL CRAIG S.;TESSERA, INC. |
发明人 |
HABA BELGACEM;MITCHELL CRAIG S. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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