APPARATUS FOR MANUFACTURING THE FLEXIBLE SUBSTRATE WITH BURIED METAL TRACE
摘要
An apparatus for manufacturing a flexible substrate with a buried metal wire according to the present invention includes: a substrate supply unit for supplying a flexible substrate; a sacrificial layer coating unit for coating a sacrificial layer including soluble polymer or photo-degradable polymer mixed with water or organic solvent on the substrate; a metal wire forming unit for forming a metal wire on the sacrificial layer; a polymer layer forming unit for forming a polymer layer in which a metal wire is buried by coating thermosetting polymer on the sacrificial layer in which the metal wire is formed; a sacrificial layer removing unit for dissolving or photo-decomposing the sacrificial layer into water or organic solvent to remove the sacrificial layer; and a substrate withdrawing unit for separating the substrate from the polymer layer from which the sacrificial layer by the sacrificial layer removing unit.
申请公布号
KR20140028243(A)
申请公布日期
2014.03.10
申请号
KR20120094088
申请日期
2012.08.28
申请人
KOREA INSTITUTE OF MACHINERY & MATERIALS
发明人
KANG, JAE WOOK;KIM, DO GEUN;JUNG, SUNG HUN;LEE, SEUNG HOON;KIM, JONG KUK