发明名称 STURUCTURE FOR SOLDERING ATTATCHMENT BETWEEN PCB AND RECEIVER MODULE IN MOBILE APPARATUS
摘要 <p>A soldering joint structure between a printed circuit board and a receiver module in a mobile apparatus according to an embodiment of the present invention comprises: a pair of L-shaped protrusions which are separated in both sides protruding from the end of the printed circuit board to solder to a joint area of a receiver module; and a round part formed inside of each edge of the pair of L-shaped protrusions.</p>
申请公布号 KR101371055(B1) 申请公布日期 2014.03.07
申请号 KR20130088143 申请日期 2013.07.25
申请人 DREAMTECH CO., LTD. 发明人 SHIN, KI SU;LEE, HO JUN;KIM, YOUNG HO
分类号 H05K1/18 主分类号 H05K1/18
代理机构 代理人
主权项
地址