发明名称 |
STURUCTURE FOR SOLDERING ATTATCHMENT BETWEEN PCB AND RECEIVER MODULE IN MOBILE APPARATUS |
摘要 |
<p>A soldering joint structure between a printed circuit board and a receiver module in a mobile apparatus according to an embodiment of the present invention comprises: a pair of L-shaped protrusions which are separated in both sides protruding from the end of the printed circuit board to solder to a joint area of a receiver module; and a round part formed inside of each edge of the pair of L-shaped protrusions.</p> |
申请公布号 |
KR101371055(B1) |
申请公布日期 |
2014.03.07 |
申请号 |
KR20130088143 |
申请日期 |
2013.07.25 |
申请人 |
DREAMTECH CO., LTD. |
发明人 |
SHIN, KI SU;LEE, HO JUN;KIM, YOUNG HO |
分类号 |
H05K1/18 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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