发明名称 SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING SYSTEM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF DISPLAYING SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To allow a housing position of a substrate in a substrate holding tool to be set arbitrarily and the substrate to be processed at a position in a good condition.SOLUTION: A substrate processing device 100 includes: a reactor 202 which processes a substrate; a substrate holding tool 217 which houses the substrate in the reactor; substrate transfer means 125 which transfers the substrate to the substrate holding tool; and a control part which is connected to an operation part for receiving operation by an operator and controls the substrate transfer means. The operation part displays a setting screen for assigning priority to substrate housing positions when an image of the substrate holding tool is selected, creates a processing condition with respect to the substrate and transmits it to the control part when the button for setting the priority is depressed, the substrate housing positions are selected in the descending order of the priority and the priority is assigned to the substrate housing position to which the substrate to be processed is transferred. The control part transfers the substrate to the substrate housing positions in the descending order of priority by controlling the substrate transfer means.
申请公布号 JP2014042058(A) 申请公布日期 2014.03.06
申请号 JP20130221169 申请日期 2013.10.24
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 MORITA OSAMU
分类号 H01L21/677 主分类号 H01L21/677
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